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M2S090S-1FGG676I Tech Specifications

IC FPGA SOC 90K LUTS 676FBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 3 Weeks
Supplier Device Package 676-FBGA (27x27)
Series SmartFusion®2
Peripherals DDR, PCIe, SERDES
Package / Case 676-BGA
Number of I/O 425
MCU Flash 512KB
Connectivity CAN, Ethernet, I²C, SPI, UART/USART, USB
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 64KB
Core Processor ARM® Cortex®-M3
Architecture MCU, FPGA
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M2S090S-1FGG676I Documents

Download datasheets and manufacturer documentation for M2S090S-1FGG676I

Others include   "M2S09"   parts

The following parts include  'M2S09' 

Part # Manufacturer Category Availability
M2S090-1FCS325 Microsemi Tertanam - Sistem Pada Chip (SoC) 2523
M2S090-1FCS325 Microsemi Corporation इसलिएसी
M2S090-1FCS325I Microsemi Tertanam - Sistem Pada Chip (SoC) 2664
M2S090-1FCS325I Microsemi Corporation इसलिएसी
M2S090-1FCSG325 Microsemi Tertanam - Sistem Pada Chip (SoC) 2714
M2S090-1FCSG325 Microsemi Corporation इसलिएसी
M2S090-1FCSG325I Microsemi Tertanam - Sistem Pada Chip (SoC) 2779
M2S090-1FCSG325I Microsemi Corporation इसलिएसी
M2S090-1FG484 Microsemi Tertanam - Sistem Pada Chip (SoC) 2653
M2S090-1FG484 Microsemi Corporation इसलिएसी

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