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M2S010TS-1VFG256T2 Tech Specifications

IC FPGA SOC

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 3 Weeks
Supplier Device Package 256-FPBGA (17x17)
Series Automotive, AEC-Q100, SmartFusion®2
Peripherals DDR, PCIe, SERDES
Package / Case 256-LBGA
Number of I/O 138
MCU Flash 256KB
Connectivity CAN, Ethernet, I²C, SPI, UART/USART, USB
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 166MHz
Primary Attributes FPGA - 10K Logic Modules
Packaging Tray
Operating Temperature -40°C ~ 125°C (TJ)
MCU RAM 64KB
Core Processor ARM® Cortex®-M3
Architecture MCU, FPGA
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M2S010TS-1VFG256T2 Documents

Download datasheets and manufacturer documentation for M2S010TS-1VFG256T2

Others include   "M2S01"   parts

The following parts include  'M2S01' 

Part # Manufacturer Category Availability
M2S010-1FG484 Microsemi Tertanam - Sistem Pada Chip (SoC) 2522
M2S010-1FG484 Microsemi Corporation इसलिएसी
M2S010-1FG484I Microsemi Tertanam - Sistem Pada Chip (SoC) 2575
M2S010-1FG484I Microsemi Corporation इसलिएसी
M2S010-1FGG484 Microsemi Tertanam - Sistem Pada Chip (SoC) 2603
M2S010-1FGG484 Microsemi Corporation इसलिएसी
M2S010-1FGG484I Microsemi Tertanam - Sistem Pada Chip (SoC) 2618
M2S010-1FGG484I Microsemi Corporation इसलिएसी
M2S010-1TQ144 Microsemi Tertanam - Sistem Pada Chip (SoC) 2791
M2S010-1TQ144 Microsemi Corporation इसलिएसी

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