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XCV300E-6BG352C Tech Specifications

IC FPGA 260 I/O 352MBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - FPGA (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Voltage - Supply 1.71 V ~ 1.89 V
Supplier Device Package 352-MBGA (35x35)
Package / Case 352-LBGA, Metal
Number of Logic Elements/Cells 6912
Number of I/O 260
Mounting Type Surface Mount
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Total RAM Bits 131072
Series Virtex®-E
Operating Temperature 0°C ~ 85°C (TJ)
Number of LABs/CLBs 1536
Number of Gates 411955
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XCV300E-6BG352C Documents

Download datasheets and manufacturer documentation for XCV300E-6BG352C

Others include   "XCV30"   parts

The following parts include  'XCV30' 

Part # Manufacturer Category Availability
XCV300-4BG352C Xilinx Tertanam - FPGA (Field Programmable Gate Array) 450
XCV300-4BG352I Xilinx Tertanam - FPGA (Field Programmable Gate Array) 592
XCV300-4BG432AF Xilinx IC Panas Khusus 49
XCV300-4BG432C Xilinx Tertanam - FPGA (Field Programmable Gate Array) 1974
XCV300-4BG432CES Xilinx IC Panas Khusus 8
XCV300-4BG432I Xilinx Tertanam - FPGA (Field Programmable Gate Array) 694
XCV300-4BGG352C Xilinx IC Panas Khusus 357
XCV300-4BGG352I Xilinx IC Panas Khusus 597
XCV300-4BGG432C Xilinx IC Panas Khusus 521
XCV300-4BGG432I Xilinx IC Panas Khusus 924

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