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XCZU19EG-1FFVD1760I Tech Specifications

IC FPGA 308 I/O 1760FCBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 1760-FCBGA (42.5x42.5)
Series Zynq® UltraScale+™ MPSoC EG
Peripherals DMA, WDT
Package / Case 1760-BBGA, FCBGA
Number of I/O 308
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU19EG-1FFVD1760I Documents

Download datasheets and manufacturer documentation for XCZU19EG-1FFVD1760I

Others include   "XCZU1"   parts

The following parts include  'XCZU1' 

Part # Manufacturer Category Availability
XCZU11EG-1FFVB1517E Xilinx Tertanam - Sistem Pada Chip (SoC) 2594
XCZU11EG-1FFVB1517E Xilinx Inc. इसलिएसी
XCZU11EG-1FFVB1517I Xilinx Tertanam - Sistem Pada Chip (SoC) 2612
XCZU11EG-1FFVB1517I Xilinx Inc. इसलिएसी
XCZU11EG-1FFVC1156E Xilinx Tertanam - Sistem Pada Chip (SoC) 2750
XCZU11EG-1FFVC1156E Xilinx Inc. इसलिएसी
XCZU11EG-1FFVC1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 2666
XCZU11EG-1FFVC1156I Xilinx Inc. इसलिएसी
XCZU11EG-1FFVC1760E Xilinx Tertanam - Sistem Pada Chip (SoC) 607
XCZU11EG-1FFVC1760E Xilinx Inc. इसलिएसी

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