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BU7966GUW-E2 Tech Specifications

BU7966GUW-E2 datasheet pdf and Interface - Specialized product details from ROHM Semiconductor stock available at Bonchip

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / IC Antarmuka Khusus
Manufacturer ROHM Semiconductor
Factory Lead Time 3 Weeks
Factory Lead Time 10 Weeks
Package / Case 63-VFBGA
Part Status Active
Applications Cell Phone
Base Part Number BU7966
RoHS Status ROHS3 Compliant
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mounting Type Surface Mount
Packaging Tape & Reel (TR)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.65V~1.95V
Interface Serial
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BU7966GUW-E2 Documents

Download datasheets and manufacturer documentation for BU7966GUW-E2

  • Datasheets

Others include   "BU796"   parts

The following parts include  'BU796' 

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BU7961GUW-E2 ROHM Semiconductor IC Antarmuka Khusus
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BU7963GUW-E2 ROHM Semiconductor IC Antarmuka Khusus
BU7964GUW ROHM IC Panas Khusus 561
BU7964GUW-E2 LAPIS Semiconductor Antarmuka - Pengemudi, Penerima, Transceiver 2513
BU7966GUW-E2 LAPIS Semiconductor Antarmuka - Khusus 2569

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BU7966GUW-E2 brand manufacturers: ROHM Semiconductor, Bonchip stock, BU7966GUW-E2 reference price. BU7966GUW-E2 parameters, BU7966GUW-E2 Datasheet PDF and pin diagram description download.You can use the BU7966GUW-E2 Pluggable Connectors, DSP Datesheet PDF, find BU7966GUW-E2 pin diagram and circuit diagram and usage method of function, BU7966GUW-E2 electronics tutorials.You can download from the Bonchip.
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