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XCZU2EG-L1SFVC784I Tech Specifications

IC FPGA 252 I/O 784FCBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 784-FCBGA (23x23)
Series Zynq® UltraScale+™ MPSoC EG
Peripherals DMA, WDT
Package / Case 784-BBGA, FCBGA
Number of I/O 252
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU2EG-L1SFVC784I Documents

Download datasheets and manufacturer documentation for XCZU2EG-L1SFVC784I

Others include   "XCZU2"   parts

The following parts include  'XCZU2' 

Part # Manufacturer Category Availability
XCZU21DR-1FFVD1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 2624
XCZU21DR-2FFVD1156E Xilinx Tertanam - Sistem Pada Chip (SoC) 2758
XCZU21DR-2FFVD1156I Xilinx IC Panas Khusus 1511
XCZU21DR-L2FFVD1156E Xilinx Tertanam - Sistem Pada Chip (SoC) 0
XCZU25DR-1FFVE1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 5418
XCZU25DR-2FFVE1156E Xilinx Tertanam - Sistem Pada Chip (SoC) 2749
XCZU25DR-2FFVG1517E Xilinx Tertanam - Sistem Pada Chip (SoC) 2561
XCZU25DR-L2FFVE1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 2706
XCZU25DR-L2FFVG1517I Xilinx Tertanam - Sistem Pada Chip (SoC) 2702
XCZU25DR-L2FSVE1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 2726

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