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XCZU3CG-1SFVA625E Tech Specifications

XCZU3CG-1SFVA625E

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 625-FCBGA (21x21)
Series Zynq® UltraScale+™ MPSoC CG
Peripherals DMA, WDT
Package / Case 625-BFBGA, FCBGA
Number of I/O 180
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU3CG-1SFVA625E Documents

Download datasheets and manufacturer documentation for XCZU3CG-1SFVA625E

Others include   "XCZU3"   parts

The following parts include  'XCZU3' 

Part # Manufacturer Category Availability
XCZU3CG-1SBVA484E Xilinx Tertanam - Sistem Pada Chip (SoC) 2675
XCZU3CG-1SBVA484E Xilinx Inc. इसलिएसी
XCZU3CG-1SBVA484I Xilinx Tertanam - Sistem Pada Chip (SoC) 2726
XCZU3CG-1SBVA484I Xilinx Inc. इसलिएसी
XCZU3CG-1SFVA625E Xilinx Inc. इसलिएसी
XCZU3CG-1SFVA625I Xilinx Tertanam - Sistem Pada Chip (SoC) 2790
XCZU3CG-1SFVA625I Xilinx Inc. इसलिएसी
XCZU3CG-1SFVC784E Xilinx Tertanam - Sistem Pada Chip (SoC) 2570
XCZU3CG-1SFVC784E Xilinx Inc. इसलिएसी
XCZU3CG-1SFVC784I Xilinx Tertanam - Sistem Pada Chip (SoC) 5429

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