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XCZU7EV-3FFVC1156E Tech Specifications

IC FPGA 360 I/O 1156FCBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 1156-FCBGA (35x35)
Series Zynq® UltraScale+™ MPSoC EV
Peripherals DMA, WDT
Package / Case 1156-BBGA, FCBGA
Number of I/O 360
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU7EV-3FFVC1156E Documents

Download datasheets and manufacturer documentation for XCZU7EV-3FFVC1156E

Others include   "XCZU7"   parts

The following parts include  'XCZU7' 

Part # Manufacturer Category Availability
XCZU7CG-1FBVB900E Xilinx Tertanam - Sistem Pada Chip (SoC) 2521
XCZU7CG-1FBVB900E Xilinx Inc. इसलिएसी
XCZU7CG-1FBVB900I Xilinx Tertanam - Sistem Pada Chip (SoC) 5366
XCZU7CG-1FBVB900I Xilinx Inc. इसलिएसी
XCZU7CG-1FFVC1156E Xilinx Tertanam - Sistem Pada Chip (SoC) 2553
XCZU7CG-1FFVC1156E Xilinx Inc. इसलिएसी
XCZU7CG-1FFVC1156I Xilinx Tertanam - Sistem Pada Chip (SoC) 2796
XCZU7CG-1FFVC1156I Xilinx Inc. इसलिएसी
XCZU7CG-1FFVF1517E Xilinx Tertanam - Sistem Pada Chip (SoC) 2666
XCZU7CG-1FFVF1517E Xilinx Inc. इसलिएसी

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