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0447640401 Tech Specifications

Conn Wire to Board RCP 4 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

Product Attribute Attribute Value
Category जोड़क / IC dan Soket Komponen
Manufacturer Molex
Factory Lead Time 3 Weeks
Factory Lead Time 11 Weeks
Mounting Type Through Hole, Right Angle
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Packaging Tray
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle
Applications General Purpose, Telecommunications
Voltage - Rated 600VAC
Contact Finish - Mating Tin
DIN Conformance NO
Filter Feature NO
Mixed Contacts NO
Terminal Pitch 3mm
Style Board to Board or Cable
Pitch - Mating 0.118 3.00mm
Row Spacing - Mating 0.118 (3.00mm)
Contact Finish Thickness - Mating 40.0μin 1.02μm
Material Flammability Rating UL94 V-0
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Material Phosphor Bronze
Contact Shape Square
Operating Temperature -40°C~105°C
Series Micro-Fit 3.0 BMI 44764
Feature Board Guide
Part Status Active
Termination Solder
Number of Positions 4
Number of Rows 2
Fastening Type Push-Pull
MIL Conformance NO
IEC Conformance NO
Contact Type Female Socket
Current Rating (Amps) 5A
Insulation Height 0.402 10.20mm
Number of Positions Loaded All
Insulation Color Black
Contact Length - Post 0.155 3.94mm
Contact Finish Thickness - Post 40.0μin 1.02μm
RoHS Status ROHS3 Compliant
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0447640401 Documents

Download datasheets and manufacturer documentation for 0447640401

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0447640401 brand manufacturers: Molex, Bonchip stock, 0447640401 reference price. 0447640401 parameters, 0447640401 Datasheet PDF and pin diagram description download.You can use the 0447640401 Pluggable Connectors, DSP Datesheet PDF, find 0447640401 pin diagram and circuit diagram and usage method of function, 0447640401 electronics tutorials.You can download from the Bonchip.
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