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0447640602 Tech Specifications

Conn Wire to Board RCP 6 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI™ Tray

Product Attribute Attribute Value
Category जोड़क / IC dan Soket Komponen
Manufacturer Molex
Factory Lead Time 3 Weeks
Factory Lead Time 13 Weeks
Mounting Type Through Hole, Right Angle
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Packaging Tray
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle
Applications General Purpose, Telecommunications
Voltage - Rated 600VAC
Contact Finish - Mating Gold
DIN Conformance NO
Filter Feature NO
Mixed Contacts NO
Terminal Pitch 3mm
Style Board to Board or Cable
Pitch - Mating 0.118 3.00mm
Row Spacing - Mating 0.118 (3.00mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 15.0μin 0.38μm
Material Flammability Rating UL94 V-0
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Material Phosphor Bronze
Contact Shape Square
Operating Temperature -40°C~105°C
Series Micro-Fit 3.0 BMI 44764
Feature Board Guide
Part Status Active
Termination Solder
Number of Positions 6
Number of Rows 2
Fastening Type Push-Pull
MIL Conformance NO
IEC Conformance NO
Contact Type Female Socket
Current Rating (Amps) 5A
Insulation Height 0.402 10.20mm
Number of Positions Loaded All
Insulation Color Black
Contact Length - Post 0.155 3.94mm
UL Flammability Code 94V-0
Contact Finish Thickness - Post 100.0μin 2.54μm
RoHS Status ROHS3 Compliant
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0447640602 Documents

Download datasheets and manufacturer documentation for 0447640602

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