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A3P600-1FG484 Tech Specifications
IC FPGA 235 I/O 484FBGA
Product Attribute | Attribute Value |
---|---|
Category | Sirkuit Terpadu (IC) / Tertanam - FPGA (Field Programmable Gate Array) |
Manufacturer | Microsemi |
Factory Lead Time | 3 Weeks |
Voltage - Supply | 1.425 V ~ 1.575 V |
Supplier Device Package | 484-FPBGA (23x23) |
Package / Case | 484-BGA |
Number of I/O | 235 |
Mounting Type | Surface Mount |
Product Attribute | Attribute Value |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Total RAM Bits | 110592 |
Series | ProASIC3 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Number of Gates | 600000 |
A3P600-1FG484 Documents
Download datasheets and manufacturer documentation for A3P600-1FG484
-
Datasheets
2.A3P600-1FG484.pdf 1.A3P600-1FG484.pdf
Others include "A3P60" parts
The following parts include 'A3P60'
Part # | Manufacturer | Category | Availability |
---|---|---|---|
A3P600-1FG144 | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2505 |
A3P600-1FG144I | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2757 |
A3P600-1FG144I | Microsemi Corporation | FPGAs | |
A3P600-1FG256 | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2756 |
A3P600-1FG256I | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2573 |
A3P600-1FG256I | Microsemi Corporation | FPGAs | |
A3P600-1FG484 | Microsemi Corporation | FPGAs | |
A3P600-1FG484I | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2605 |
A3P600-1FG484I | Microsemi Corporation | FPGAs | |
A3P600-1FGG144 | Microsemi | Tertanam - FPGA (Field Programmable Gate Array) | 2769 |
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A3P600-1FG484 brand manufacturers: Microsemi, Bonchip stock, A3P600-1FG484 reference price. A3P600-1FG484 parameters, A3P600-1FG484 Datasheet PDF and pin diagram description download.You can use the A3P600-1FG484 Pluggable Connectors, DSP Datesheet PDF, find A3P600-1FG484 pin diagram and circuit diagram and usage method of function, A3P600-1FG484 electronics tutorials.You can download from the Bonchip.
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