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M2S050-1FCS325I Tech Specifications

IC FPGA SOC 50K LUTS

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 3 Weeks
Supplier Device Package 325-BGA (11x11)
Series SmartFusion®2
Peripherals DDR, PCIe, SERDES
Package / Case 325-TFBGA
Number of I/O 200
MCU Flash 256KB
Connectivity CAN, Ethernet, I²C, SPI, UART/USART, USB
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 166MHz
Primary Attributes FPGA - 50K Logic Modules
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 64KB
Core Processor ARM® Cortex®-M3
Architecture MCU, FPGA
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M2S050-1FCS325I Documents

Download datasheets and manufacturer documentation for M2S050-1FCS325I

Others include   "M2S05"   parts

The following parts include  'M2S05' 

Part # Manufacturer Category Availability
M2S050-1FCS325 Microsemi Tertanam - Sistem Pada Chip (SoC) 2501
M2S050-1FCS325 Microsemi Corporation इसलिएसी
M2S050-1FCS325I Microsemi Corporation इसलिएसी
M2S050-1FCSG325 Microsemi Tertanam - Sistem Pada Chip (SoC) 2633
M2S050-1FCSG325 Microsemi Corporation इसलिएसी
M2S050-1FCSG325I Microsemi Tertanam - Sistem Pada Chip (SoC) 2631
M2S050-1FCSG325I Microsemi Corporation इसलिएसी
M2S050-1FG484 Microsemi Tertanam - Sistem Pada Chip (SoC) 2782
M2S050-1FG484 Microsemi Corporation इसलिएसी
M2S050-1FG484I Microsemi Tertanam - Sistem Pada Chip (SoC) 5416

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