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XCZU4CG-1FBVB900I Tech Specifications

IC FPGA 204 I/O 900FCBGA

Product Attribute Attribute Value
Category Sirkuit Terpadu (IC) / Tertanam - Sistem Pada Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 900-FCBGA (31x31)
Series Zynq® UltraScale+™ MPSoC CG
Peripherals DMA, WDT
Package / Case 900-BBGA, FCBGA
Number of I/O 204
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Product Attribute Attribute Value
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU4CG-1FBVB900I Documents

Download datasheets and manufacturer documentation for XCZU4CG-1FBVB900I

Others include   "XCZU4"   parts

The following parts include  'XCZU4' 

Part # Manufacturer Category Availability
XCZU4CG-1FBVB900E Xilinx Tertanam - Sistem Pada Chip (SoC) 5305
XCZU4CG-1FBVB900E Xilinx Inc. इसलिएसी
XCZU4CG-1FBVB900E FBVB900 Xilinx IC Panas Khusus 709
XCZU4CG-1FBVB900I Xilinx Inc. इसलिएसी
XCZU4CG-1SFVC784E Xilinx Tertanam - Sistem Pada Chip (SoC) 805
XCZU4CG-1SFVC784E Xilinx Inc. इसलिएसी
XCZU4CG-1SFVC784I Xilinx Tertanam - Sistem Pada Chip (SoC) 5314
XCZU4CG-1SFVC784I Xilinx Inc. इसलिएसी
XCZU4CG-2FBVB900E Xilinx Tertanam - Sistem Pada Chip (SoC) 656
XCZU4CG-2FBVB900E Xilinx Inc. इसलिएसी

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